new_page_header_w_links.gif
 
World IC Socket Market
Table of Contents
Research Report P-505-07
September 2007

 
 


Chapter 1 - The World IC Socket Connector Market


IC Socket Connectors By Region (2006-2011)
IC Socket Connectors By Market (2006-2011)
IC Socket Market Size for Two Major Categories and Their Sub Categories
2006 IC Socket Sales – by Region by Product Line
Major Manufacturers Of IC Socket Connectors
Top Five IC Socket Manufacturers
Tyco Electronics – 12%
Molex Incorporated – 10.8%
Foxconn (Hon Hai) – 3.5%
FCI – 2.6%
3M – 1.9%
Manufacturers Whose Major Focus is IC Sockets
Aries Electronics – Test & Burn-in Sockets
Chupond Precision Co. Ltd – Production Sockets
Enplas Semiconductor Peripheral Corporation – Test & Burn-in Sockets
Johnstech International – Test & Burn-in Sockets
Loranger International Corp – Test & Burn-in
Mill-Max – Test & Burn-in and Production Sockets
Plastronics Socket Company – Test & Burn-in Sockets
Sensata Technologies –Test & Burn-in Sockets
Win Way Technology Pvt Ltd. – Test & Burn-in
Yamaichi – Test & Burn-in and Production
Worldwide List of IC Socket Manufacturers


Chapter 2 - IC Socket Connectors - Business And Technology Trends
|

IC Performance
IC Device Packages
Reasons For IC Sockets
Economics of IC Socket Use
IC Sockets as a Tool in Electronic Assembly
IC Sockets Create Flexibility
IC Sockets are Widely Used
Business And Economic Considerations
Our Electronics World
International Expansion of the Global Market for IC Sockets
Response From Countries Outside the US
International Expansion of Electronic Companies Design Centers
Proliferation of IC Socket Suppliers
Mergers and Acquisitions
Intellectual Property, a Key to IC Socket Development
Small Companies Respond to Specialized Requirements
Production Sockets Versus Test and Burn-in Sockets
General
The Necessity of Rapid Response for Test and Burn-in Applications
Profitability in the IC Socket Market
Technology Trends
General
The Affect of RoHS Requirements on IC Socket Manufacturers
RoHS Compliance Not Universal
ROHS Compliance Changes Processes and Products
Standards Organizations
Variations in Contacts and Interconnection Methods
Move to Surface Mounting:
Continued Need for More Connections
Improved Performance Affects IC Packages
The Trend to Test Multiple Devices at Once
Life Cycle Performance Considerations
Factors Affecting Cycles
Metal Plating
Contamination and Degradation
Test Board Considerations
Alignment
Summary of Life Cycle Consideration
Types of IC Sockets
Single In-Line, SIP Sockets
Dual In-Line, DIP Sockets
QFP, Quad Flat Pack Sockets; PQFP, Plastic Quad Flat Pack Sockets; TQFP, Thin Quad Flat Pack Sockets
QFN IC Sockets
SOIC, Small Outline IC Sockets
LCC, Leaded Chip Carrier and PLCC, Plastic Leaded Chip Carrier Sockets
SOJ, Small Outline J-Lead Sockets
Memory Module Sockets
PGA, Pin Grid Array Sockets
BGA, Ball Grid Array Sockets
Coplanarity Issues
Alignment Issues
Fine Pitch Demands Superior Performance
Custom Sockets Develop Into Standard Versions
Styles of BGA Sockets
Photos courtesy of E-Tec Interconnect
Sockets Combine with Adapters
BGA Sockets for Production Testing
LGA, Land Grid Array Sockets
Custom IC Sockets
New and Future Trends in IC Sockets
Future Trends
Summary


Chapter 3 - IC Sockets - World Market By Region & Product Line


North American IC Socket Market
European IC Socket Market
Japanese IC Socket Market
Chinese IC Socket Market
Asia/Pacific IC Socket Market
ROW IC Socket Market
Total IC Socket Market

 
 



Copyright © 2008, Bishop & Associates, Inc.
Bishop & Associates, Inc. - 1209 Fox Glen Drive - St. Charles, IL 60174 - Phone 630/443-2702 - Fax 630/443-2704