Backplane - Midplane
And Cable Assemblies
3 to 20+ Gb/s

Bishop and Associates, Inc. has just released a new 13-chapter research report providing a complete analysis of Evolving High-Speed Connectors. This new report details backplane, midplane, and high-speed backplane cable assemblies. Connector values are provided for each category for the years 2007, 2008, 2009, and 2013, as well as region of the world.

Connectors designed to operate in multi-gigabit applications have proliferated over the past four years providing system designers greatly expanded interconnect options and performance levels.  Advances in connector as well as signal conditioning technology have pushed interface bandwidth from 3 Gb/s to 20+ Gb/s, with at least one supplier introducing a 40 Gb backplane connector.  This market research report addresses the many aspects of the high-speed interconnect market from what is driving demand for faster channels, to defining the key characteristics of the leading connector families that are currently available.  Detailed market estimates and forecasts extending to 2013 for backplane and cable connectors by application and region of the world are featured.

A variety of factors associated with high-speed channels have a major influence on their behavior.  Chapters are devoted to reviewing related system elements including driver and receiver technology, printed circuit board materials, as well as channel modeling, and performance measurement systems.

A new chapter focused on innovation provides examples of new creative approaches to addressing some of the challenges associated with interconnection and packaging of next generation electronic equipment.

This market research report also includes several tutorial chapters on connector and high-speed design issues that enable a non-technical reader to gain from the information provided.

Technology

Bandwidth demands are increasing resulting in greater challenges to satisfying signal integrity requirements.  At the same time packaging density puts more contacts in closer proximity to each other creating potential for increased crosstalk and signal degradation.

Systems consume more power that generates more heat.  Connectors must be designed to support power / thermal management schemes.

Emerging standards such as the Intel Quick-Path Interconnect are driving changes in both current as well as future high-speed connectors and have implications for every element in the channel.

High-speed copper cable assemblies that incorporate passive or active equalization techniques are expanding the anticipated practical bandwidth and length limitations of just a few years ago.

Designing 6 Gb/s channels is not a trivial issue, causing engineers to rely on their chosen connector vendor to provide extensive selection and design support 24/7 on a global basis.

Connector manufacturers are working closely with suppliers of driver and receiver chips to demonstrate performance in faster and longer channels.

 Connector Market

Connector users want a clear performance migration path to support, anticipated bandwidth needs of their next generation equipment.  This is driving connector manufacturers to provide multi-tiered product families that can enable product upgrades without changing product families or even PCB circuit layout.

Reliance on a single source for critical components is no longer acceptable.  High-speed connector manufacturers have responded by cross-licensing many of their flagship product families to product mechanically and electrically identical interfaces.  This process has allowed each supplier to offer a broad range of products at market driven prices. 

The market has stratified with a select group of highly competitive connector suppliers offering a full range of state-of-the-art interconnects.  A secondary tier is focused on supporting individual segments of the market that requires less technical resources and / or may offer a quicker return on investment.

The pace of new connector induction has been exceptional over the past two years, with more products in the development pipeline.  Many of these new interfaces are benefiting from better understanding of the behavior of high-speed signals resulting in the refinement of the connector and its PCB launch. 

This market research report is the third in a continuing series of investigations of this highly dynamic product segment.  The advancement of this technology together with experience gained in designing these unique interfaces may set the stage for the evolution of all types of next generation electronic connectors.  Those suppliers who have consistently made the necessary investment in resources to develop this expertise may emerge as the only viable suppliers capable of supporting future application requirements.

The preceding topics are just a sampling of the information and detailed data provided in this new report.