Existing connectors originally designed to operate in the 3-4 Gb/s range, are now being promoted as capable of supporting 10+ Gb/s.  This “performance creep” is a result in better test and simulation tools as well as advanced signal conditioning features integrated into transmitter and receiver silicon chips.

Parallel bus structures are rapidly being replaced by high-speed serial switch architectures, many of which are defined by an industry standard.  Connectors optimized for low voltage differential signaling are the interface of choice in these applications.

The engineering community has accepted the concept of shieldless high-speed connectors.  Questions have been raised about the long-term durability of these new interconnects, but the potential reduced cost has changed market price expectations for the entire high-speed connector landscape.

Compliant pin termination to the PCB is the primary connector attachment method, but designers are starting to look at signal distortion created by the connector footprint, and may be looking at alternatives such as surface mount and compressive connection.

Current systems are designed to operate in the 3.125 to 4 Gb/s range, but designers are looking for connector performance headroom that extends to as high as 10 Gb/s.

The transition from time domain to frequency domain test and simulation methods is well underway, as connector models based on S-Parameters  become more available.  Finding qualified engineers with the training and experience to work with these tools is a challenge for both connector manufacturers as well as users.

Research into fiber optic backplanes has been largely put on the back burner as the ability of copper interconnects continues to be expanded.  Future systems are now considering copper interconnects operating at 25 Gb/s.

Midplane architecture is experiencing greater interest with several major connector suppliers introducing new connector families specifically designed to support orthogonal midplane interconnects.

Traditional connectors and system architecture may be reaching inherent technical limits, which will accelerate interest in new packaging schemes.  Some of these new concepts will require radical changes in the way systems are designed as well as manufactured.

High-speed cable assembly requires precision fabrication techniques and may incorporate passive or active devices to assure performance to specification.

Amphenol TCS, FCI Electronics, Molex and Tyco Electronics dominate the current market for high-speed backplane connectors.  Each of these suppliers is actively developing new products several of which will be introduced over the next 6 months.

High-volume applications for these advanced connectors have been slower to develop than had been anticipated.  This is likely due to a combination of the 2000-2003 recession, continued use of open pin field lower cost connectors, limited ccess to high-speed chips, and lack of experience in designing multi-gigabit channels.

The recent acquisition of Teradyne by Amphenol TCS has greatly elevated Amphenol in the high-speed connector arena.  Access to the Teradyne basket of advanced connectors and technology together with a license to tool the FCI AirMax connector family allows them to offer two of the three leading high-speed backplane connectors in the market today.

The cost of developing advanced connectors has caused several suppliers to drop out of the race, while others continue to introduce new products.  Several recently released connectors are very application specific further fracturing the market into niche markets.

High-speed connectors defined by industry standards are becoming more common as users seek ways to shorten the design cycle, reduce costs, and assure defined levels of performance.

Developing, tooling and providing extensive customer support for these advanced connectors is a very costly process.  Current market participants have begun offering an extensive array of on-line tools to assist customers in implementing their products.