Chapter 1 - Report Scope and Methodology

Report objectives
Study methodology
Data collection forms
Connector manufacturer survey
Connector user survey

Chapter 2 - Introduction and Definitions

Preface
Introduction
Connector definitions / technologies

Chapter 3 - High Speed Connector Basics

Common backplane architectures
High-speed transmission line issues
Defining features of high speed connectors
The second sourcing imperative
Performance measurement systems

Chapter 4 - The Need for Speed

Market drivers to higher speed interfaces
Speed vs. density
The influence of industry standards
Market trends

Chapter 5 - High Speed Interconnect System Elements

Driver and receiver technology
Printed circuit board materials
Printed circuit board design and fabrication

Chapter 6 - Overview of current high-speed backplane/midplane connectors

Amphenol TCS – VHDM, VHDM-HSD, GbX,
Ventura, Aptera, Crossbow
ERNI Components – ERmet ZD, ERmet zeroXT
FCI – Metral 4000, AirMax VS
Hirose – Hx2
3M– HSHM
Molex – VHDM, VHDM-HSD
Tyco Electronics –HS3, HM Zd, MultiGig RT
Micro TCA Connectors

Chapter 7 - High-Speed Mezzanine Connectors

Mezzanine connector architecture
Advantages of mezzanine packaging
Interface types/ configurations
Mezzanine connector applications
The role of standards

Chapter 8 - Overview of current High-Speed Mezzanine Connectors

Amphenol TCS – VHDM Stacker, NeXLev
ERNI – MicroSpeed, Stacking ERmet Zd
FCI – Meg / Gig Array, Stacking AirMax VS
Fujitsu – MicroGiGaCN
HARTING – AMC Connector
Hirose – IT1, IT-2, IT-4 Series
Interconnect Systems – HILo
Molex – Plateau HS Mezz, AMC connector
Samtec – Rise-Up, Q Pairs, Sam Array
Tyco Electronics – Mictor, STEP-Z, AMC
Yamaichi Electronics – AMC

Chapter 9 - High-Speed Backplane Cable Assemblies

Bringing Cable to the backplane
Cable assembly characteristics
Typical applications

Chapter 10 - Overview Of Selected High-Speed Backplane Cable Assembly Suppliers

WL Gore & Associates
Meritec
Molex
Samtec
Sanmina SCI
Tensolite
Tyco Electronics
Other suppliers

Chapter 11 - Connector Design Features

Introduction
Backplane Connectors
Amphenol TCS – Aptera L Series
Amphenol TCS –CrossBow 2mm+
Amphenol TCS – GbX1
Amphenol TCS – GbX- L Series
Amphenol TCS – GbX –E Series
Amphenol TCS – Ventura
Amphenol TCS – VHDM – H Series
ERNI – ERmet Zero XT
FCI – Metral 40001
FCI – AirMax VS1
Hirose – HX-2
Tyco – Z-Pack HS-3
Tyco – Z-Pack HM-Zd
Tyco – Z-Pack Max
Tyco – MultiGig RT
3M – Met Pak HSHM
Orthogonal Midplane Connectors
Amphenol TCS – CrossBow Matrix
Tyco – Z-Pack Max Orthogonal
Mezzanine Connectors
Amphenol TCS – VHDM Stacker
Amphenol TCS – NexLev
ERNI – MicroSpeed
FCI – Meg-Array
FCI – Gig-Array
Fujitsu – MicroGigaCN
Hirose – IT-2 Series
Hirose – IT-4 Series
Molex – Plateau HS Mezz
Samtec – Q Series
Samtec – Sam Array
Samtec – DP Array
Samtec – SeaRay
Tyco – Mictor
Tyco – 05 FH Shielded Giga
High Speed Cable Assemblies
Comparison of physical attributes
Comparison of electrical performance

Chapter 12 - Market Analysis / Forecasts

Measurement criteria
High-Speed backplane / midplane connectors
World market 2004 -2010 by bandwidth segment
World market 2004 - 2010 by geographic region
World market 2004 - 2010 by end user
High Speed Mezzanine Connectors
World market 2004 -2010 by bandwidth segment
World market 2004 -2010 by geographic region
World market 2004 -2010 by end user
High Speed Copper Cable Assemblies
World market 2004 -2010 by bandwidth segment
World market 2004 -2010 by geographic region
World market2004 -2010 by end user

Chapter 13 - The Fiber Optic Option

Fiber optic backplane development status

Chapter 14 - High-Speed connector innovation

Efficere Technologies
Particle interconnects
SiliconPipe contact design
Foxconn FX-VMP Orthogonal connector

Chapter 15 - Major Findings And Conclusions

Appendix - List Of Contributors